Advancing Solder Joint Modeling in PCBs: A Two-Scale Co-Simulation Approach for Shock & Vibration Analysis Using LS-Dyna

The integrity of solder joints in PCBs under dynamic loading conditions is critical for the reliability of electronic devices. Traditional modeling methods, such as representing solder joints with beam elements or solid elements in one-scale simulations, often face trade-offs between computational efficiency and accuracy. In this study, we introduce a two-scale co-simulation approach using LS-Dyna to address this challenge and provide both accuracy and efficiency in PCB analysis.